In-Line and off-line combination component/solder joint inspection systems help detect defects
related to component placement such as presence/absence, part number and polarity. They also help
identify defects in solderability including insufficient solder, bridging, excess solder, lifting,
solder balls, non-wetting, etc. Automated 3D X-ray inspection is performed to detect bridging and
opens not detectable optically.
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