Quality Control and Failure Mode Analysis

X-ray Fluorescence Analyzer

For measuring plating/coating thickness and materials composition analysis.

Instron Universal Materials Testing Machine

For tension, compression, bending and component testing.

Thermal Analysis

Equipment includes:
Perkin Elmer DMA 7e
Perkin Elmer TMA-7
Perkin Elmer Pyris 1 TGA
Perkin Elmer DSC7

One common application is measurement of T/sub g/.

Solderability Testing

Multicore MUST System II is used for diagnosing solderability issues as well as verifying compliance with IPC/EIA/JEDEC J-STD-002B and IPC/EIA J-STD-003A.

Time Domain Reflectometry (TDR)

For impedance measurement and line-to-line skew in differential pairs on bare boards.

Microscopy

A wide variety of precision microscopes including a Nikon SMZ1500 stereomicroscope and a Nikon MM-60 measuring microscope.