Surface Mount Technology Manufacturing

• Support for fast turn prototype runs through high volume manufacturing. Our SMT placement rates exceed 3.5 million placements per 8 hour shift. Flexible lines enable fast product changeover.
• Production information is tracked in real time allowing a quick response to changing requirements or process correction.

Screen Printing and Solder Paste/Silver Epoxy Dispensing

• High Accuracy, high-throughput screen printing with support for lead free solder paste.
• Solder paste and silver epoxy dispensing using Asymtek dispensing systems.

Solder Paste Inspection

• Both 2D for registration and bridge detection and 100% 3D solder paste inspection including 3D height and true volume/area measurements for measuring solder volume.

Placement of SMT Components

• Modern placement lines allow placement of everything from 01005s (0.4 mm x 0.2 mm) to the largest SMT odd-form components such as connectors and power supplies.

Reflow

• Our reflow ovens have a minimum of ten zones and are compatible with lead free processes. Profiling is performed utilizing ECD SuperM.O.L.E. Gold systems.